ADVANCED PACKAGING

Advanced packaging including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-packaging

Adaptive patterning, large fields, and unmatched resolutions for new packaging applications. Capable of volume or batch production of System in Package (SiP), MEMS & Sensor Packaging, Fan Out Packaging, and 2.5D/3D IC Packaging.
Enabling next generation interposers — Metaposers*.

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APPLICATIONS
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APPLICATIONS

Secure Chip ID

Powerful new technology in the never-ending fight against security threats

Security is a must in a world where counterfeiters abound. Secure Chip ID is the leading anti-counterfeit capability, capable of hard-coding unique information into each chip seamlessly during routine fabrication flow. Helps to enable essential system level security by ensuring the provenance of critical IC components.

High Value, Rapid Prototyping

A broad range of advanced customizable and innovative process technologies for growing markets

  • Rapid prototyping: Digital printing and maskless patterning enable rapid prototyping for faster first article delivery and system productization
  • Accelerate the path to production: Speed the development cycle for faster cycles of learning
  • High value low volume enabled with customizable patterning: Further enables the power of structured ASICs
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APPLICATIONS
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APPLICATIONS

Photonics

High performance, low loss, novel structures

  • Expand into multiple high growth photonics segments
  • Optical connections at the board, package, and device level
  • Specialty applications for unique IoT requirements: medical diagnostic testing, optical biotechnology sensing, faster high resolution augmented reality, …

YOUR DREAM

NO LONGER JUST FOR RESEARCH

Multibeam’s unique multicolumn e-beam technolgy brings the high precision of e-beam direct writing to  productivity levels that enable your applications

  • Up to 1000X more productive than conventional e-beam
  • Precision 100X greater than laser direct write
  • 150mm, 200mm, 300mm and other wafer sizes
  • Variety of substrate types and shapes
  • Multibeam applications team with expertise in developing the direct write results needed with MEBL system, cleanroom processing, and on-site metrology
Impossible on Optical Masks
APPLICATIONS